Heat-generating element cooling device

摘要

A heat-generating element cooling device comprises: a cover member disposed at a top surface of a heat-generating element mounted on a printed circuit board a suitable distance away from the top surface and having substantially the same area as the heat-generating element; and one or more fan units, the fan units being used to blow cooling air into a clearance between said cover member and said heat-generating element to cool the heat-generating element.