发明名称 Multilayer wiring board embedded with transmission line conductor
摘要 Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.
申请公布号 US2002017963(A1) 申请公布日期 2002.02.14
申请号 US20010897127 申请日期 2001.07.03
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SHIMAMOTO TAKESHI;YAMAGUCHI KAZUFUMI;TSUKAMOTO MASAHIDE;TATEISHII FUMIKAZU;TAGUCHI YUTAKA
分类号 H01P3/08;H05K1/02;H05K1/09;H05K3/10;(IPC1-7):H01P3/08 主分类号 H01P3/08
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