发明名称 |
Multilayer wiring board embedded with transmission line conductor |
摘要 |
Transmission line structure is composed of a pair of signal conductors which are embedded in one wiring region of a dielectric layer and a thickness in height of the signal conductor is larger than a width, and is constituted so that a coupling impedance between the adjacent signal conductors is lower than a coupling impedance between the signal conductor and another conductor formed in another wiring region, and thus to provide a multi-layer wiring board having a transmission line structure of high wiring density and excellent transmission characteristic.
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申请公布号 |
US2002017963(A1) |
申请公布日期 |
2002.02.14 |
申请号 |
US20010897127 |
申请日期 |
2001.07.03 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SHIMAMOTO TAKESHI;YAMAGUCHI KAZUFUMI;TSUKAMOTO MASAHIDE;TATEISHII FUMIKAZU;TAGUCHI YUTAKA |
分类号 |
H01P3/08;H05K1/02;H05K1/09;H05K3/10;(IPC1-7):H01P3/08 |
主分类号 |
H01P3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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