| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a board material for a printed circuit, capable manufacturing a printed circuit board with higher density and simply and economically, and with superior dimensional accuracy. SOLUTION: The method for manufacturing the board material for the printed circuit comprises the steps of juxtaposing many metal wires 13 at a prescribed pitch in a die 10 for forming, by arranging two metal plates 22 having many through-holes 2 at a prescribed pitch and adhering films 26 and arranged via a gap 28 so that the positions of the holes 2 are matched and the films 26 are opposed; then casting a composite material made of a plastic and ceramics in the die 10, curing the material; and then removing the plates 22 to obtain the board material, in which the wires 13 are penetrated in the plate thickness direction. |
