| 摘要 |
PROBLEM TO BE SOLVED: To provide a stacked die set for integrated circuit package in which consumption of material and the thickness can be reduced while shortening the production process. SOLUTION: Chips 21a, 21c are attached to the surface of boards 20a, 20b and encapsulated 22 and then chips 21b, 21d are attached to the rear surface of the boards 20a, 20b and encapsulated to produce a stacked die set 2A. The boards 20a, 20b having chips 21a, 21b, 21c and 21d on the surface and rear surface are then stacked and concatenated through protrusions 23a for concatenating carriers electrically thus forming a stacked die set. Since the surface and rear surface of the boards 20a, 20b can be processed simultaneously, production process can be shortened.
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