| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip resistor that is equipped with an upper electrode layer which is never corroded even if a gap is formed between a protective layer and a plating layer, and reduced in manufacturing cost, by decreasing material conducive to a corrosion preventing effect in amount as much as possible, keeping a corrosion preventive effect high. SOLUTION: An upper electrode protective layer 23 is formed on the top surface of an upper electrode layer 22 under a part where a protective layer 40 comes into contact with a plating layer 26. The upper electrode protective layer 23 is formed of thick film of material of high sulfur resistance such as silver alloy containing 5.0% or above palladium.</p> |
