RESIN COMPOSITION FOR SEMICONDUCOR SEALING, SEMICONDUCTOR DEVICE USING THE SAME, SEMICONDUCTOR WAFER AND MOUNTING STRUCTURE OF SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing, a semiconductor device, a semiconductor wafer and a mounting structure of the semiconductor device excellent in storage stability as well as discharge property and coating workability, which is an epoxy resin sealing agent and shows low viscosity at relatively low temperature of 80 deg.C or less. SOLUTION: This resin composition for a semiconductor sealing includes (A) an epoxy resin, (B) a phenol resin, and (C) a latent curing accelerator, it is characterized by being solid or by showing viscosity of 400 Pa.s or less at 25 deg.C, and viscosity of 200 Pa.s or less at 80 deg.C, it is preferable to use a microcapsule curing accelerator as a latent curing agent. The semiconductor device is obtained by mounting and sealing a semiconductor element on the printed circuit board by using this resin composition for semiconductor sealing, and capable of sealing the void between the circuit board and the semiconductor chip, and capable of sealing so as to contain the semiconductor chip.