发明名称 APPARATUS FOR SOFTENING AND DISSOLVING RESIN BY HIGH TEMPERATURE HEATING
摘要 <p>PROBLEM TO BE SOLVED: To provide an apparatus for softening and dissolving a resin by high temperature heating wherein the recovering and reuse of the resin is carried out by the casting or metal mold molding of the liquefied resin, with safety, at a low cost and without environmental pollution based on the fact that the heating of the resin at a high temperature results in the softening and liquefying at a peculiar temperature, though the dissolution, softening, volume reducing, recovering, recycling and reuse of resins require conventionally a lot of cost, and space. SOLUTION: The apparatus comprises the following processes: heating a dissolution treatment liquid 7 in a dissolving tank 1 up to a resin dissolving temperature at a gas heating device 10 and a liquid heating device 11; opening a lid 8, charging a resin into the dissolving tank 1, and contacting the resin 13 with the dissolution treatment liquid 7 and giving a blow 14 of a high temperature-heated gas on the resin with a blower 9 and also laying under a high temperature gas atmosphere 16 to thereby soften and liquefy the resin; depositing the liquefied resin 17 down on the dissolving tank 1 owing to the difference in the specific gravity from the dissolution treatment liquid; opening a discharge valve 4 and then opening the pressurizing valve 5 to make a discharge 21 of the liquefied resin 17; introducing the discharged liquefied resin 22 subjected to the discharge 21 into a mold or metal mold molding device 23; and forming a resin molding 24.</p>
申请公布号 JP2002069231(A) 申请公布日期 2002.03.08
申请号 JP20000305529 申请日期 2000.08.30
申请人 MUKOYAMA TOYOJI 发明人 MUKOYAMA TOYOJI
分类号 C08J11/08;F27D11/06;F27D19/00;(IPC1-7):C08J11/08 主分类号 C08J11/08
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