| 摘要 |
<p>PURPOSE: To provide a quality, low-cost semiconductor device, whose rigidity is large at a high temperature immediately after the resin sealing operation of a semiconductor chip, in which electrode pads are scattered and arranged over the whole face of the semiconductor chip, which is highly functional and whose size is large. CONSTITUTION: In the semiconductor device, the semiconductor chip 11, an adhesive, metal thin wires 14, inner leads 13a which are extended up to the surface of the semiconductor chip 11 which correspond to the respective electrode pads 17a to 17e, and which are arranged on a side farther outward than the circumference of the semiconductor chip 11, and die pads 16 in which steps deeper than the sum of the thickness size of the semiconductor chip 11 and the thickness size of the adhesive are formed, are sealed with a sealing resin 15. Extension parts of the inner leads 13 are used as external leads 13b, to protrude to the side father outward than the sealing resin 15.</p> |
