| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a circuit board that can facilitate release of trapped air bubbles and prevent deterioration of connecting strength and connection failures with the improvement of reliability in IC connection. SOLUTION: This circuit board comprises a FPC board, plural strips of copper foil arranged in three directions on the FPC board, a cover lay arranged along the periphery of the FPC board, and a ACF attached on the copper foils and the cover lay and with which the IC is connected. The cover lay on which the ACF is attached has grooves in three directions, and the FPC board has many perpetration holes under where the IC is connected and on the periphery of the IC, and also has guide grooves extended toward inside from both sides of each groove on the cover lay.</p> |
