| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the resin of a package from easily peeling off from a die pad and a lead terminal for improving reliability, and at the same time to prevent the partial resin at a gate fill section from easily remaining in a support tie bar for smoothly conveying a lead frame without having a bad influence even if the resin remains partially. SOLUTION: When the die pad 6, a semiconductor device 11, and one portion of the lead terminals 7, 8, and 9 are sealed by the resin for forming the package at a frame section 3 of the lead frame, a retract surface 20 is provided via resin fill space 19 from an outer end edge 4a of the support tie bar 4 to a width direction Y at a connection section 18 in a recess 17 that is formed at one portion of the support tie bar 4 remaining in a gate fill section, and a retract surface 22 is additionally provided via resin fill space 21 from front to back sides at the side of the semiconductor device 11 out of both the front and back sides that are both sides in a plate thickness direction Z of the support tie bar 4. In addition, the resin bonding force of the support tie bar 4 is weakened, and resin formation is made so that the outer end edge 4a of the support tie bar 4 is opened.</p> |
