SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a method for manufacturing the same having a satisfactory junction state between the semiconductor and a printed circuit board. SOLUTION: Conductive bonding adhesive 5 is applied to a protruding section 2b of a connecting terminal electrode 2 of a semiconductor substrate 1. After the applied conductive bonding adhesive 5 is cured, electroless plating solution 7 is applied to a tip of the cured conductive bonding adhesive 5. The protruding section 2b contacted and hot pressed on a substrate terminal electrode 3a of the connecting terminal electrode 2 creates alloy junction layer 7b between the connecting terminal electrode 2 and the substrate terminal electrode 3a to strengthen junction between the connecting terminal electrode 2 and the substrate terminal electrode 3a. The direct application of the electroless plating solution to the substrate terminal electrode 3a instead of direct application of the electroless plating solution to the tip the conductive bonding adhesive 5 also provides the same effect.