ADHESIVE SHEET FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE USING THE SHEET

摘要

PROBLEM TO BE SOLVED: To provide a tape for TAB that has a small amount of warpage and superior machining characteristics, and a semiconductor device using the tape. SOLUTION: This adhesive sheet for semiconductor deices has a laminate comprising at least one protection fm layer and an adhesive layer. In this case, the adhesive layer should contain a compound having an oxetane ring.