发明名称 |
Wiring connection structure, terminal portion, parallax barrier substrate, and touch panel |
摘要 |
There is provided a wiring connection structure connecting a transparent conductive film formed on a main surface of a transparent substrate having the main surface and a metal wiring formed on the main surface and made of a metal material, wherein the metal wiring is formed to extend from the main surface onto the transparent conductive film and to cover the transparent conductive film. |
申请公布号 |
US9491857(B2) |
申请公布日期 |
2016.11.08 |
申请号 |
US201214009337 |
申请日期 |
2012.04.02 |
申请人 |
SHARP KABUSHIKI KAISHA |
发明人 |
Misaki Katsunori |
分类号 |
H05K1/11;G02B27/22;G06F3/044;G02F1/1333;C03C27/06 |
主分类号 |
H05K1/11 |
代理机构 |
Keating & Bennett, LLP |
代理人 |
Keating & Bennett, LLP |
主权项 |
1. A wiring connection structure connecting a transparent conductive film formed on a main surface of a transparent substrate having said main surface and a metal wiring formed on said main surface and made of a metal material, wherein
said metal wiring is formed to extend from said main surface onto said transparent conductive film and to cover said transparent conductive film; one or more holes are formed in said transparent conductive film to extend from an upper surface to said main surface, and said metal wiring formed to cover said transparent conductive film is formed to be in contact with said main surface located at said one or more holes. |
地址 |
Osaka JP |