发明名称 Wiring connection structure, terminal portion, parallax barrier substrate, and touch panel
摘要 There is provided a wiring connection structure connecting a transparent conductive film formed on a main surface of a transparent substrate having the main surface and a metal wiring formed on the main surface and made of a metal material, wherein the metal wiring is formed to extend from the main surface onto the transparent conductive film and to cover the transparent conductive film.
申请公布号 US9491857(B2) 申请公布日期 2016.11.08
申请号 US201214009337 申请日期 2012.04.02
申请人 SHARP KABUSHIKI KAISHA 发明人 Misaki Katsunori
分类号 H05K1/11;G02B27/22;G06F3/044;G02F1/1333;C03C27/06 主分类号 H05K1/11
代理机构 Keating & Bennett, LLP 代理人 Keating & Bennett, LLP
主权项 1. A wiring connection structure connecting a transparent conductive film formed on a main surface of a transparent substrate having said main surface and a metal wiring formed on said main surface and made of a metal material, wherein said metal wiring is formed to extend from said main surface onto said transparent conductive film and to cover said transparent conductive film; one or more holes are formed in said transparent conductive film to extend from an upper surface to said main surface, and said metal wiring formed to cover said transparent conductive film is formed to be in contact with said main surface located at said one or more holes.
地址 Osaka JP