| 摘要 |
PURPOSE: A semiconductor molding apparatus and a related method are provided to eliminate a need of an additional process required after molding due to a conventional use of a supporting pin penetrating a cavity. CONSTITUTION: The apparatus includes a pair of plates(20) facing each other and moving back and forth, a pair of dies(30) formed on inner surfaces of the plates(20) and having the cavity(5) and a lead frame insertion hole(10), and at least one pair of supporting pins(70) for supporting a lead frame(13) inserted in the cavity(5). The supporting pins(70) are connected respectively to a pair of lifting blocks(40) moving back and forth by means of driving members(50). In addition, according to the confronting movement of the lifting blocks(40), the pins(70) appear or disappear in the cavity(5) of the dies(30). Therefore, the pins(70) do not produce a conventional pin hole in a molding compound injected in the cavity(5), so that a conventional process for filling the pin hole is not needed.
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