发明名称 Method for manufacturing knockdown board material
摘要 Method for manufacturing knockdown board material, including steps of: using a conveying device to convey a board material and immerge the board material into a resin tank to which a fireproof agent is added, after the resin fully infiltrates into the board material, the board material being compressed by rubber rollers and then dried and solidified to form a protective film; attaching printed paper to the surface of the board material by way of adhesion or thermal transfer-printing stripes on the surface of the board material; painting a layer of surface treatment agent on the surface of the board material by way of rolling or spraying; laying EVA foam material on back face of the board material and embossing stripes on the foam material; and cutting the board material into a certain shape.
申请公布号 US6383322(B1) 申请公布日期 2002.05.07
申请号 US20000570030 申请日期 2000.05.12
申请人 WANG WEN PING 发明人 WANG WEN PING
分类号 B32B5/18;B32B38/08;E04F15/10;(IPC1-7):B32B31/08;B32B31/12;B32B31/18 主分类号 B32B5/18
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