发明名称 |
Polishing pad having an advantageous micro-texture and methods relating thereto |
摘要 |
This invention relates to polishing pads and a method for making the polishing pad surface readily machineable thereby facilitating permanent alteration of the polishing pad surface to create an advantageous micro-texture. The advantageous micro-texture is statistically uniform and provides a polishing pad with improved break-in preconditioning time. Polishing pads of this invention find application to the polishing/planarization of substrates such as glass, dielectric/metal composites and substrates containing copper, silicon, silicon dioxide, platinum, and tungsten typically encountered in integrated circuit fabrication.
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申请公布号 |
US2002058469(A1) |
申请公布日期 |
2002.05.16 |
申请号 |
US20010775972 |
申请日期 |
2001.02.02 |
申请人 |
PINHEIRO BARRY SCOTT;NAUGLER STEVEN;KULP MARY JO |
发明人 |
PINHEIRO BARRY SCOTT;NAUGLER STEVEN;KULP MARY JO |
分类号 |
B24B37/04;B24D3/00;B24D13/14;(IPC1-7):B24D11/00 |
主分类号 |
B24B37/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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