| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor module which contains an element that responds upon reception of light and which facilitates manufacturing. SOLUTION: Fine roughness is made on the whole region or a part of a die for forming the module except a light receiving part region. Thereby, fine roughness is made on the whole region or a part of the surface of the module except the light receiving part region. By immersing the module in a solution containing a light-shielding material, a film containing the light-shielding material is adhered to the surface having the roughness. By heat treating the module to which the film has been adhered, a module, to which the film containing the light-shielding material is adhered on the whole region or a part except the light receiving part, is made.</p> |
