发明名称 |
Multichip module and method of fabrication therefor |
摘要 |
An electrical interconnection medium having a plurality of first conductive regions arranged in first and second layers and interconnected to form a first offset mesh plane of a first electrical potential and a signal path comprising at least a selected isolated portion of at least one of the first conductive regions which selected portion would otherwise be a part of the offset mesh plane. <IMAGE> |
申请公布号 |
EP0614220(B1) |
申请公布日期 |
2002.06.19 |
申请号 |
EP19940102816 |
申请日期 |
1994.02.24 |
申请人 |
THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ARKANSAS |
发明人 |
SCHAPER, LEONARD W. |
分类号 |
H01L23/12;H01L23/52;H01L23/538;H01L25/04;H01L25/18;H05K1/00 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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