| 摘要 |
A contact structure for establishing electrical contact with contact targets. The contact structure is formed of a contact substrate and a plurality of contactors in which each of the contactors has a hook shape. The contactor has a tip portion which is protruded in a vertical direction to form a contact point, a base portion which is inserted in a through hole provided on the contact substrate in such a way that an end of the contactor functions as a contact pad for electrical connection at a bottom surface of the contact substrate, and a curved portion provided between the tip portion and the base portion which produces a contact force when the contactor is pressed against the contact target. A further aspect is a method for producing a large number of contactors on a wafer in a horizonal direction and removing the contactors from the wafer to be mounted on a substrate to form the contact structure such as a probe card, IC chip, or other contact mechanism in a vertical direction.
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