摘要 |
<p>PROBLEM TO BE SOLVED: To provide a power system electronic component loaded with a plurality of power system bare chips. SOLUTION: A lead frame 1 is provided with a plurality of component loading parts 4a-4d, and the power system bare chips 10 are respectively loaded on the respective component loading parts 4a-4d. Also, a control board 11, where the control circuit of the plurality of the power system bare chips 10 is formed, is loaded over the plurality of the component loading parts 4a-4d. Respective power system semiconductor elements 10 and the control board 11 are electrically connected via wires 12a.</p> |