发明名称
摘要 <p>PROBLEM TO BE SOLVED: To effectively prevent grain boundary corrosion of a lead terminal due to a silver solder material and thus prevent failure of the lead terminal, by making the lead terminal of a metal containing an iron-nickel alloy to which niobium is externally added at a predetermined % by weight. SOLUTION: A lead terminal 7 of an electronic component is made of a metal containing an iron-nickel alloy to which niobium is externally added at 0.5-5.0% by weight. By causing the lead terminal to contain niobium, which restrains roughening of crystal, roughening of crystal of the lead terminal 7 and diffusion of a silver solder material 8 into the grain boundary are substantially eliminated even when the heat to melt the silver solder material 8 is applied to the lead terminal 7 in mounting the lead terminal 7 via the silver solder material 8 on a meatless metal layer 5 provided on an insulating base 1. Consequently, grain boundary corrosion of the lead terminal 7 due to the silver solder material 8 is effectively prevented, and failure of the lead terminal 7 is not generated. Thus, the lead terminal 7 may be rigidly connected to an external electric circuit.</p>
申请公布号 JP3309045(B2) 申请公布日期 2002.07.29
申请号 JP19960090986 申请日期 1996.04.12
申请人 发明人
分类号 H01L23/12;H01L23/50;(IPC1-7):H01L23/12 主分类号 H01L23/12
代理机构 代理人
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