| 发明名称 |
ADHESIVE FILM FOR SEMICONDUCTOR, SUBSTRATE FOR MOUNTING SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain an adhesive film capable of preventing peeling of a cover film from an adhesive layer during blanking and bringing the cover film to be easily removed after adhesion and provide a substrate for mounting semiconductor chips to which the film is adhered and a semiconductor device produced by using the film. SOLUTION: This adhesive film for semiconductor is equipped with a cover film on at least one side face of an adhesive layer and has 1-100 N/m peel force between the adhesive layer and the cover film.</p> |
| 申请公布号 |
JP2002212525(A) |
申请公布日期 |
2002.07.31 |
| 申请号 |
JP20010013335 |
申请日期 |
2001.01.22 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
KANEDA MAIKO;HOSOKAWA YOICHI;URUNO MICHIO;MATSUZAKI TAKAYUKI |
| 分类号 |
B32B27/00;C09J7/02;C09J133/00;C09J163/00;C09J171/10;C09J201/00;H01L21/52;H01L21/60;H01L23/12;H01L23/14;(IPC1-7):C09J7/02 |
主分类号 |
B32B27/00 |
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