| 发明名称 |
POLYARYLKETONE RESIN FILM AND METAL LAMINATE USING THE SAME |
| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polyarylketone resin film suitable as a member for electronics, especially having improved end-breaking resistance, and a metal laminate using the film. SOLUTION: The polyarylketone resin film is produced by mixing 100 pts.wt. of a resin composition consisting of a crystalline polyarylketone resin (A) and an amorphous polyetherimide resin (B) with a filler in the range of 5-50 pts.wt., and subjecting the mixture to a rapidly cooling process for film formation. When the film is warmed up at a heating speed of 10 deg.C/min on differential scanning calorimetry, the determined crystallization peak temperature Tc (A+B) satisfies the following equation: Tc(A)<Tc(A+B)<=Tg(B)+20. In the equation, each of the characteristic values is a value determined by differential scanning calorimetry at a heating speed of 10 deg.C/min; Tc (A) is the crystallization peak temperature ( deg.C) of an amorphous film made of a simple substance of a crystalline polyarylketone resin (A); Tc (A+B) is the crystallization peak temperature ( deg.C) of a film of the present invention; and Tg (B) is a glass transition temperature ( deg.C) of a film made of a simple substance of amorphous polyetherimide resin (B).</p> |
| 申请公布号 |
JP2002212314(A) |
申请公布日期 |
2002.07.31 |
| 申请号 |
JP20010013139 |
申请日期 |
2001.01.22 |
| 申请人 |
MITSUBISHI PLASTICS IND LTD |
发明人 |
TANIGUCHI KOICHIRO;YAMADA SHINGETSU |
| 分类号 |
C08J5/18;B32B15/08;B32B15/088;B32B27/00;B32B27/28;C08K3/00;C08L73/00;C08L79/08;H05K1/03;(IPC1-7):C08J5/18 |
主分类号 |
C08J5/18 |
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