| 摘要 |
PROBLEM TO BE SOLVED: To correspond to a plurality of kinds of chip components of different horizontal widths by the same component supply device and prevent troubles in transportation of a chip component due to dust attaching to a chip component, etc. SOLUTION: A path 36, wherein a chip component 3 moves horizontally, is formed of an attaching body 29, spacers 30A, 30B, 30C, 30D, path formation plates 31A, 31B and a cover body 34, and an upper surface position of each of the spacers 30C, 30D is in a lower position than an upper surface position of the path formation plate 31B. Therefore, a space 37 for storing dust attaching to the chip component 3 is formed. |
