发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION |
摘要 |
PROBLEM TO BE SOLVED: To provide a new negative type photosensitive resin composition developable with a dilute alkali solution and capable of supplying a high sensitivity and high resolution resist pattern. SOLUTION: The photosensitive resin composition contains at least an alkali- soluble resin (A), a polymerizable monomer (B) and a photopolymerization initiator (C) and the alkali-soluble resin (A) is a polymer containing modified (hydroxystyrene) into which an ethylenically unsaturated group has been introduced as a structural unit. |
申请公布号 |
JP2002229208(A) |
申请公布日期 |
2002.08.14 |
申请号 |
JP20010031063 |
申请日期 |
2001.02.07 |
申请人 |
TOPPAN PRINTING CO LTD |
发明人 |
OBARA MIDORI;SHIMIZU SHIGEJI;OE YASUSHI |
分类号 |
G03F7/038;C08F2/44;C08F2/50;C08F8/00;C08F257/00;G03F7/027;G03F7/028;H01L21/027 |
主分类号 |
G03F7/038 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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