发明名称 PHOTOSENSITIVE RESIN COMPOSITION
摘要 PROBLEM TO BE SOLVED: To provide a new negative type photosensitive resin composition developable with a dilute alkali solution and capable of supplying a high sensitivity and high resolution resist pattern. SOLUTION: The photosensitive resin composition contains at least an alkali- soluble resin (A), a polymerizable monomer (B) and a photopolymerization initiator (C) and the alkali-soluble resin (A) is a polymer containing modified (hydroxystyrene) into which an ethylenically unsaturated group has been introduced as a structural unit.
申请公布号 JP2002229208(A) 申请公布日期 2002.08.14
申请号 JP20010031063 申请日期 2001.02.07
申请人 TOPPAN PRINTING CO LTD 发明人 OBARA MIDORI;SHIMIZU SHIGEJI;OE YASUSHI
分类号 G03F7/038;C08F2/44;C08F2/50;C08F8/00;C08F257/00;G03F7/027;G03F7/028;H01L21/027 主分类号 G03F7/038
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