| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that the airtightness of the inside of a semiconductor package from the adhesion force insufficiency of a cover is damaged, in addition, a side conductor layer is slipped off together with the blur of the open end of a circular groove, the continuity resistance of casterration is changed to unstabilize earth potential, and the transmission characteristic of a high frequency signal is remarkably lowered from non-matching of characteristic impedance. SOLUTION: In a semiconductor device storing package 1 provided with a substrate 2, a frame 3 and input and output terminals 4, a plurality of grooves 8 are formed from the upper end to the lower end of an outer face and/or an inner face on the frame body, an angle making the tangent line of the end of the inner face of the groove 8 in the width direction cross section of the groove 8 and the outer face and/or the inner face of the frame 3 is 95-170 degrees, and the thickness t of the frame 3 on the bottom part of the groove 8 is 0.15 mm or more.
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