SUBSTRATE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A substrate is provided to prevent a contamination caused by an attaching unit and to improve a vent hole by preventing the attaching unit from being injected to the vent hole. CONSTITUTION: A substrate(100) comprises a single layer circuit formation medium(110), circuit patterns(120) made of Cu formed on defined portions of the single layer circuit formation medium(110) and a solder mask(150) coated on the circuit patterns(120) except for circuit ground parts(120a,120b). At this point, Ni and Au are sequentially plated on the outer surface of the circuit ground parts(120a,120b). The substrate(100) further includes a vent hole(100a) formed in a chip mounting part and a semiconductor chip(500). At this point, one portion of the vent hole(100a) is covered with Cu layer(A).