MOLD APPARATUS FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND METHOD FOR MOLDING SEMICONDUCTOR PACKAGE USING THE SAME

摘要

PURPOSE: A mold apparatus for manufacturing semiconductor package is provided to prevent a chip pad tilt and flash. CONSTITUTION: A mold apparatus comprises a top mold(300), a bottom mold(302) and a location pin(304) formed in the top mold(300) for informing a position of first pin in a semiconductor package(310). The mold apparatus further includes an eject pin(306) formed in the bottom mold(302) for separation function of the semiconductor package(310) completely hardened from the surface of the bottom mold(302) and a bottom mold vacuum hole(308) formed in the bottom mold(302) for adsorbing an exposed chip pad using vacuum force. At this point, the bottom mold vacuum hole(308) is connected with a vacuum pump.