发明名称 |
HIGH MOLECULAR COMPOUND, RESIST MATERIAL AND PATTERN FORMING METHOD |
摘要 |
PROBLEM TO BE SOLVED: To provide a resist material having small absorption at the wavelength of F2 excimer laser light for exposure and capable of easily forming a fine pattern perpendicular to a substrate. SOLUTION: The high molecular compound has repeating units of formula (1) (where A is a divalent organic group and forms a 4-20C cyclic hydrocarbon group together with C atoms which bond at both ends of A, the cyclic hydrocarbon group may be a bridged cyclic group and may contain a heteroatom; R<1> -R<3> are each H, F, a 1-4C alkyl or a 1-4C fluorinated alkyl, at least one of R<1> -R<3> contains F; and R<4> is an acid labile group). The resist material is sensitive to high energy beams and is excellent in sensitivity and resolution at <=200 nm, particularly <=170 nm wavelength and in plasma etching resistance. |
申请公布号 |
JP2002268226(A) |
申请公布日期 |
2002.09.18 |
申请号 |
JP20010070208 |
申请日期 |
2001.03.13 |
申请人 |
SHIN ETSU CHEM CO LTD;MATSUSHITA ELECTRIC IND CO LTD;CENTRAL GLASS CO LTD |
发明人 |
HATAKEYAMA JUN;TAKAHASHI TOSHIAKI;WATANABE ATSUSHI;ISHIHARA TOSHINOBU;SASAKO MASARU;ENDO MASATAKA;KISHIMURA SHINJI;OTANI MITSUTAKA;MIYAZAWA SATORU;TSUTSUMI KENTARO;MAEDA KAZUHIKO |
分类号 |
G03F7/039;C08G77/24;C08K5/00;C08L83/08;G03F7/40;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|