发明名称 PLATING APPARATUS OF ELECTRONIC TERMINAL
摘要 PURPOSE: A plating apparatus of an electronic terminal is provided to remove deformation of the electronic terminal generated while the electronic terminal is passing through a moving passageway by enlarging the moving passageway of partitions along which the electronic terminal is moved. CONSTITUTION: In a plating apparatus comprising first, second and third degreasing tanks(1,2,3), a water washing tank(5), an acid washing tank(6), prime plating tanks(8,9), first and second gold plating tanks(11,13) and a post-treatment tank(17), the plating apparatus of an electronic terminal is characterized in that a passageway(30) of partitions(39) installed between each of the first, second and third degreasing tanks, water washing tank, acid washing tank, prime plating tanks, gold plating tanks and post-treatment tank is enlarged in a rectangular shape, an air supply pipe(23) is installed at the end of the third degreasing tank, acid washing tank(6), prime plating tank, gold plating tanks and post-treatment tank to eject air thereto, first and second water supply pipes(24,25) are installed on the water washing tank to spray water, a gold molten solution is flown into the gold plating tanks, a fibrous material is formed on the outer surface of the gold plating tanks, and a plurality of discharge holes are formed on a gold supply pipe with spaced apart from each other in a certain distance to discharge the gold molten solution.
申请公布号 KR20020073950(A) 申请公布日期 2002.09.28
申请号 KR20010013919 申请日期 2001.03.17
申请人 JUNG, UL YUN 发明人 JUNG, UL YUN
分类号 C25D17/00;(IPC1-7):C25D17/00 主分类号 C25D17/00
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