发明名称
摘要 In pre-treating a surface of a substrate in a process of forming a narrowed thin film pattern on the surface of the substrate from a solution such as a plating liquid, a mask with an opening corresponding to the thin film pattern to be formed later is formed on the surface of the substrate. Then, by micronizing a pre-treating liquid such as a water, a plating liquid, an acidic liquid ad an alkaline liquid, an atmosphere containing microparticles having diameters smaller than the minimum distance of the opening of the mask is produced. The substrate is positioned into the atmosphere, and the microparticles of the pre-treating liquid are stuck on the surface of the substrate exposing to the lower part of the opening of the mask. In using a water as the pre-treating liquid, the substrate is positioned into an atmosphere containing moisture vapor and the water particles are stuck on the surface of the substrate through their condensation. Or the substrate is positioned into an atmosphere containing water microparticles produced by aerifying a water through supersonic vibration and the microparticles are stuck on the surface of the substrate through their precipitation. Thereby, the microparticles of the pre-treating liquid can be stuck in the minute opening of the mask and the damage of the mask pattern due to the pre-treating liquid can be avoided.
申请公布号 JP3329441(B2) 申请公布日期 2002.09.30
申请号 JP19980288519 申请日期 1998.10.09
申请人 发明人
分类号 H01L23/48;C25D5/02;C25D5/08;C25D5/34;C25D7/12;H01L21/288;(IPC1-7):C25D5/34 主分类号 H01L23/48
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