发明名称 |
Holder for electroless plating and method of electroless plating |
摘要 |
A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.
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申请公布号 |
US2002150693(A1) |
申请公布日期 |
2002.10.17 |
申请号 |
US20020170501 |
申请日期 |
2002.06.14 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
KOBAYASHI MIKIYA;TAKANO YOSHIHIKO;SADAKI KIYOMI;UKAI HIROYUKI;HOSOMI HIDETSUGU;IMAMURA AKIRA |
分类号 |
C23C18/31;B05C13/02;C23C18/16;(IPC1-7):B05D1/18;B05D3/12 |
主分类号 |
C23C18/31 |
代理机构 |
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代理人 |
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主权项 |
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