发明名称 Holder for electroless plating and method of electroless plating
摘要 A holder for electroless plating to hold a plurality of ceramic elements for ceramic electronic parts during electroless plating treatment, each surface of said ceramic elements being to be electroless plated, said holder comprising a plurality of cells to house each of said plurality of ceramic elements separately, and each of said cells having such a structure as to permit the flow communication of a plating solution into the cell.
申请公布号 US2002150693(A1) 申请公布日期 2002.10.17
申请号 US20020170501 申请日期 2002.06.14
申请人 MURATA MANUFACTURING CO., LTD. 发明人 KOBAYASHI MIKIYA;TAKANO YOSHIHIKO;SADAKI KIYOMI;UKAI HIROYUKI;HOSOMI HIDETSUGU;IMAMURA AKIRA
分类号 C23C18/31;B05C13/02;C23C18/16;(IPC1-7):B05D1/18;B05D3/12 主分类号 C23C18/31
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