| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which is excellent in photosensitivity, gives a cured material excellent in flexibility, resistance to soldering heat, heat aging resistance, resistance to electroless gilding, can realize the development with a dilute alkaline solution, and is suitable for a soldering resist and an interlaminar insulating layer. SOLUTION: The resin composition contains a maleimide-containing polycarboxylic acid (meth)acrylate resin (A) obtained by reacting a reaction product (c) of an epoxy resin (a) having two epoxy groups in the molecule and a maleimide-containing monocarboxylic acid (b) with optional components comprising a polyol compound (d), a tetracarboxylic acid dianhydride (e) and a hydroxylated (meth)acrylate (f), and a diluent (B). |
