发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer carriage system for a semiconductor manufacturing line which copes with to 300 mm wafers. SOLUTION: The carriage of a wafer within the bay (a group of devices) of a clean room is performed by RGV(rail guided vehicle) 11 traveling in a straight line at a high speed on a carriage rail 3 laid on the floor of the clean room. The carriage area where the RGV 11 travels is separated from a work region for a person by a partition 4, and is so structured that the person cannot enter the carriage area at operation of the line.</p> |
申请公布号 |
JP2002319609(A) |
申请公布日期 |
2002.10.31 |
申请号 |
JP20010121735 |
申请日期 |
2001.04.19 |
申请人 |
HITACHI LTD |
发明人 |
WAKABAYASHI TAKAYUKI;UCHINO TOSHIYUKI;KIGUCHI YASUO;KOIKE ATSUYOSHI |
分类号 |
G05B19/418;H01L21/00;H01L21/677;(IPC1-7):H01L21/68 |
主分类号 |
G05B19/418 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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