发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a wafer carriage system for a semiconductor manufacturing line which copes with to 300 mm wafers. SOLUTION: The carriage of a wafer within the bay (a group of devices) of a clean room is performed by RGV(rail guided vehicle) 11 traveling in a straight line at a high speed on a carriage rail 3 laid on the floor of the clean room. The carriage area where the RGV 11 travels is separated from a work region for a person by a partition 4, and is so structured that the person cannot enter the carriage area at operation of the line.</p>
申请公布号 JP2002319609(A) 申请公布日期 2002.10.31
申请号 JP20010121735 申请日期 2001.04.19
申请人 HITACHI LTD 发明人 WAKABAYASHI TAKAYUKI;UCHINO TOSHIYUKI;KIGUCHI YASUO;KOIKE ATSUYOSHI
分类号 G05B19/418;H01L21/00;H01L21/677;(IPC1-7):H01L21/68 主分类号 G05B19/418
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