INTERNAL COMBUSTION ENGINE IGNITION DEVICE AND PACKAGE CONTAINING ELECTRONIC PART USED THEREFOR

摘要

PROBLEM TO BE SOLVED: To protect a circuit unit and a power device unit included in a molded- type internal combustion engine ignition package (igniter) against damages, by improving a power semiconductor device in heat radiating properties and by protecting a package against warpages caused, by a linear expansion coefficient difference between a heat sink/molded resin. SOLUTION: A power semiconductor device 2 used as a switching device for an ignition coil and a heat sink (lead frame) 1-2 used for the power semiconductor device 2 are embedded in batch in a molding resin 4. The top and under surface of the heat sink 1-2 together with the power semiconductor device 2 are covered with the molded resin 4, and at least either the top surface or the undersurface of the heat sink 1-2 is partially exposed.