| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which has high reliability against thermal variation and a low cost, can be formed thin and lays electrodes as an LGA. SOLUTION: A first and second buildup layers 13, 14 made of soft resins each having a modulus of elasticity of 5000 MPa or less are formed on one surface of a hard core substrate 12, and an electrode 30 connected to a via 29 is formed on the outer surface of the second buildup layer 14. A semiconductor chip 10 is mounted through an anisotropically conductive layer 15 on a surface of the core substrate 12, having no buildup layer.</p> |
