发明名称 COOLING DEVICE FOR MOLD
摘要 PROBLEM TO BE SOLVED: To provide a molding free of dissolution loss, adhesion, or crinkling. SOLUTION: The cooling device 10 is inserted in a core pin 7 protruding in a cavity of a mold 1, and provided with a body part 11 to be inserted in a large diameter coolant hole 751 and a pipe part 12 inserting and passing through inside the body part 11 and inserting its tip in a small diameter cooling hole 741. On the tip part side of the body part 11, one line of a lead groove 111 formed into a spiral state is formed, and on the terminal of the lead groove 111, a recovery hole 112 of the coolant is formed. The coolant poured from the side of a coupling 13 for putting in the coolant passes through a forward path 15 of the coolant of the pipe part 12, and blows out from the tip of the pipe part 12 inside a small diameter coolant hole 741 to penetrate in a large diameter coolant hole 751, while cooling a small diameter mold part 74. The coolant having flowed to the large diameter coolant hole 751 is moved and guided to the recovery hole 751 along the lead groove 111, thereby cools the large diameter mold part 75, while moving into the coolant hole 751 and accumulating.
申请公布号 JP2002361392(A) 申请公布日期 2002.12.17
申请号 JP20010170147 申请日期 2001.06.05
申请人 DYNAMO:KK 发明人 NOKURA TOSHITO
分类号 B22D17/22;B22C9/06;B29C33/04;(IPC1-7):B22D17/22 主分类号 B22D17/22
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