PACKAGED SENSOR ASSEMBLY

摘要

A packaged sensor assembly includes: a packaging structure, having at least one opening; a humidity sensor and a pressure sensor, which are housed inside the packaging structure and communicate fluidically with the outside through the opening, and a control circuit, operatively coupled to the humidity sensor and to the pressure sensor; wherein the humidity sensor and the control circuit are integrated in a first chip, and the pressure sensor is integrated in a second chip distinct from the first chip and bonded to the first chip.

主权项

1. A packaged sensor assembly comprising:
a packaging structure having an opening; a first semiconductor chip that integrates a humidity sensor and a control circuit operatively coupled to the humidity sensor, the humidity sensor housed inside the packaging structure and in fluid communication with an environment external to the sensor assembly through the opening; and a second semiconductor chip that integrates a MEMS pressure sensor bonded to the first semiconductor chip, the pressure sensor operatively coupled to the control circuit, the pressure sensor housed inside the packaging structure and in fluid communication with the environment external to the sensor assembly through the opening.