发明名称 METHOD FOR MOUNTING ELECTRONIC COMPONENT TO FLEXIBLE PRINTED-WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a method for mounting electronic components on a flexible printed-wiring board for easily applying or releasing FPC to or from a fixing board and at the same time strongly fixing the electronic components. SOLUTION: In the method for mounting electronic components to the flexible printed-wiring board, when electronic components are to be mounted on the surface of the flexible printed-wiring board, an adhesion sheet is applied to a surface at the opposite side to a surface for mounting electronic components on the flexible printed-wiring board in advance, the flexible printed-wiring board is fixed to the fixation board via the adhesion sheet, and then the electronic components are mounted on the surface of the flexible printed-wiring board. The adhesion sheet may be a double-sided adhesion sheet where an adhesive mass is formed on both the surfaces of a base. Preferably, the base is a porous one. With the adhesive mass for composing an adhesive mass layer, acrylic adhesive mass and/or silicone adhesive mass can be used appropriately.
申请公布号 JP2002368497(A) 申请公布日期 2002.12.20
申请号 JP20010176838 申请日期 2001.06.12
申请人 NITTO DENKO CORP 发明人 TANAKA KAZUMASA;MUTA SHIGEKI;YAMAMOTO HIROSHI
分类号 C09J7/02;C09J133/00;C09J183/04;H05K13/04 主分类号 C09J7/02
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