发明名称 |
Method for metallizing textured surfaces |
摘要 |
A method for creating electrically conducting or semiconducting patterns on a textured surface including plural reliefs of amplitude greater than or equal to 100 nanometers, including: preparing a substrate during which at least the textured surface of the substrate is made electrically conducting; coating during which at least one layer of an imprintable material is laid on the textured surface, made electrically conducting, of the substrate; pressing a mold including valleys or protrusions to transfer the valleys or the protrusions of the mold into the imprintable material to form patterns therein; removing the mold while leaving the imprint of the patterns in the imprintable material; exposing the textured surface, made electrically conducting, of the substrate, at a bottom of the patterns; and electrically depositing an electrically conducting or semiconducting material into the patterns to form conducting or semiconducting patterns. |
申请公布号 |
US9515205(B2) |
申请公布日期 |
2016.12.06 |
申请号 |
US201214002854 |
申请日期 |
2012.03.05 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE AUX ENERGIES ALTERNATIVES |
发明人 |
Pernel Carole;Chaix Nicolas;Landis Stefan |
分类号 |
H01L31/0236;H01L31/0224;H01L31/0747;H01L31/18;H01L21/033;H01L21/288;H01L31/0376 |
主分类号 |
H01L31/0236 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A method for creating electrically conducting or semiconducting patterns on a textured surface, comprising:
providing a substrate having a textured surface formed by a plurality of reliefs of amplitude greater than or equal to 100 nanometers; preparing the substrate to make the whole of the textured surface of the substrate electrically conducting; coating at least one layer of an imprintable material on the textured surface which was made electrically conducting; pressing a mold comprising valleys and protrusions such that the valleys and the protrusions of the mold are transferred into the imprintable material to form patterns therein; removing the mold while leaving an imprint of the patterns in the imprintable material; etching bottom portions of the patterns to expose the textured surface at a bottom of the patterns; and electrically depositing at least an electrically conducting or semiconducting material into the patterns to form conducting or semiconducting patterns on the textured surface. |
地址 |
Paris FR |