SEMICONDUCTOR FABRICATION APPARATUS

摘要

PURPOSE: A semiconductor fabrication apparatus is provided to minimize the damage of an electric line such as a TC(Thermo Couple) line in a shifting process of an elevating shaft by forming a groove on a bottom face of the elevating shaft and fixing the TC line to the groove. CONSTITUTION: A chuck(20) is installed in a predetermined position of the inside of a chamber. The chuck(20) can be with an electrostatic chuck. An elevating shaft(22) is located at a lower portion of the chuck(20). The elevating shaft(22) is moved to an upper portion or a lower portion by an air pressure cylinder or an oil pressure cylinder. A groove(22a) is formed on a predetermined region of a bottom face of the elevating shaft(22). A lamp is installed in the inside of the chuck(20) in order to heat the inside of the chuck(20). A TC line(26) is installed in the inside of the elevating shaft(22). The TC line(26) is connected with an inner face of the elevating shaft(22) and a thermocouple reader(28). The TC line(26) is inserted and fixed to the groove(22a).