| 摘要 |
PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a display device. SOLUTION: A method of manufacturing semiconductor device includes a first step of mounting semiconductor elements 3 on a frame F for manufacture on which leads 4 are arranged in a fixed direction, in a state where the leads 4 are divided into a plurality of groups each of which is composed of a fixed number of leads 4 and electrically connecting the elements 3 to the leads 4; and a second step of housing and fixing the elements 3 and parts of the leads 4 electrically connected to the elements 3 in a case. First and second cases 1A and 1B are prepared as the case and, at the time of manufacturing the semiconductor device corresponding to one module, only one group of leads 4 is housed in the first case 1A in the second step. At the time of manufacturing the semiconductor device corresponding to a plurality of modules, a plurality of groups of leads 4 is collectively housed in the second case 1B in the second step. |
