| 摘要 |
Provided is a method of manufacturing a semiconductor laser device capable of reducing time required for manufacture and preventing deterioration in performance due to heating, and a mounting plate and a supporting plate which are used in the method of manufacturing a semiconductor laser device. A semiconductor laser device is formed by stacking a laser chip, a sub-mount and a heat sink and adhering them to each other. The laser chip has a structure such that a p-side electrode and an n-side electrode are formed on the same surface of the crystalline substrate. The sub-mount has a structure such that a front face solder film and a back face solder film are formed on front and back surfaces of a supporting body, respectively. When the laser chip, the sub-mount and the heat sink are stacked, the front face solder film is positioned between the laser chip and the sub-mount and the back face solder film is positioned between the sub-mount and the heat sink. Application of heat and pressure on thus stacked the laser chip, the sub-mount and the heat sink melts the front face solder film and the back face solder film, whereby the laser chip, the sub-mount and the heat sink adhere to each other simultaneously.
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