Method for selectively depositing diffusion barriers

摘要

A method is provided for selectively depositing a silicided metal nitride diffusion barrier layer in a semiconductor structure including providing at least one anisotropically etched opening extending through at least one insulating layer and in closed communication with a metallic underlayer; conformally depositing a metal nitride layer over the at least one anisotropically etched opening under conditions such that the metal nitride layer has a relatively higher deposition rate onto the sidewalls of the at least one anisotropically etched opening for a period of time compared to a deposition rate over the metallic underlayer; and, exposing the metal nitride layer to a silicon containing gaseous ambient under conditions such that silicon is incorporated into the metal nitride layer to form a silicided metal nitride layer.