CONDITIONER OF CMP EQUIPMENT

摘要

PURPOSE: A conditioner of CMP equipment is provided to condition uniformly all surfaces of a polishing pad by forming diamond rings on a center portion as well as an outside portion of a conditioner disc. CONSTITUTION: A polishing pad(220) is used for planarizing layers formed on a semiconductor substrate. A center portion of a conditioner disc is contacted with the polishing pad(220). Diamond particles are adhered on the center portion and an outside portion of the disc conditioner. A surface of the polishing pad(220) is conditioned by using the diamond particles adhered on the center portion and the outside portion of the disc conditioner. The diamond particles have a shape of ring. The polishing pad(220) is formed with polyurethane. A plurality of grooves are formed on the surface of the polishing pad(220).