| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and a method for connecting an electronic component capable of manufacturing with higher productivity than that of a prior art for small quantity and multi-kind circuit substrates, and to provide the circuit substrate and an electronic component mounting device. SOLUTION: The apparatus for connecting the electronic component comprises a mounting member 110, a heater 120. Thus, the apparatus brings the circuit substrate into contact with the mounting member having substantially the same size as that of the one substrate 5, and heats them. Accordingly, a loss can be reduced for the small-sized substrate, and various types of the substrates can be individually correspondingly heated. Therefore, small quantity and multi-kind circuit substrates can be manufactured with higher productivity than that of the prior art. |
