| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent the destruction of a soldered part soldered in a preceding process by heat generated in joining in a succeeding process. SOLUTION: For the thermoelectric module 100, a solder material forming the soldered part 5 joining a thermoelectric element 1 and electrodes 2a and 3a of insulation substrates 2 and 3 contains a resin curable by heat or the like or a curable resin layer 5a is provided on the surface of the soldered part 5. Or, in a manufacturing method for an article having a plurality of soldering processes, the solder material used in at least one of the soldering processes of the preceding process contains the curable resin or the curable resin layer is provided on the surface of the soldered part 5 formed in at least one of the soldering processes of the preceding process.</p> |
