| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a die attach paste for semiconductor bonding having low elastic modulus, high adhesiveness, and excellent solder crack resistance. SOLUTION: This die attach paste essentially comprises (A) a hydrocarbon compound having a number average mol.wt. of 500 or higher but not higher than 30,000 and at least one double bond or a derivative thereof, (B) a (meth) acrylic monomer having at least one glycidyl group, (C) a radical polymerization catalyst, and (D) a filler. A semiconductor device prepared by using the paste is provided.</p> |
