发明名称 MOLDING DIE AND METHOD FOR MANUFACTURING MOLDING DIE
摘要 PROBLEM TO BE SOLVED: To provide a molding die which is capable of rapidly heating and quenching the wall surface of a cavity and thereby, enhancing the fluidity and transferability of a resin and at the same time, shortening a molding cycle and upgrading the quality of a product and its productivity, and a method for manufacturing the molding die. SOLUTION: This molding die is configured of a cavity members 7 and 8 which are fitted to the mold bodies 5 and 6 of a cavity side half 2 and a movable half 3 and constitute a cavity 4 and heat insulating plates 9 and 10 provided on the cavity face sides 7a and 8a opposite to the cavity members 7 and 8. In addition, grooves 23 and 24 which constitute temperature control water circuits 21 and 22 are formed in the cavity face sides 7a and 8a opposite to the cavity members 7 and 8 and the grooves 23 and 24 are arranged between the cavity members 7 and 8 and the heat insulating plates 9 and 10 respectively. Thus the temperature control water circuits 21 and 22 are formed near the wall face of the cavity 4.
申请公布号 JP2003145538(A) 申请公布日期 2003.05.20
申请号 JP20010348491 申请日期 2001.11.14
申请人 MITSUBISHI HEAVY IND LTD 发明人 UECHI TETSUO;TODA NAOKI;KARIYA TOSHIHIKO;HAYASHI NORIYA
分类号 B29C33/02;B29C33/38;B29C45/73;B29K63/00;B29K91/00;(IPC1-7):B29C33/02 主分类号 B29C33/02
代理机构 代理人
主权项
地址