| 摘要 |
<P>PROBLEM TO BE SOLVED: To adsorb and adjust the deviation between the arrangement of a connecting terminal such as a lead and that of pads. <P>SOLUTION: On a wafer W where a plurality of pads P are formed, a conductor pattern 14 that is continuous to the pad P at one end is formed, and a bump B used as a connecting point at the other end of the conductor pattern 14 is connected to a connecting terminal used as a substrate. By the conductor pattern 14, the arrangement of the bump B that differs from that of the pad P can be obtained, thus absorbing and adjusting the deviation between the arrangement of the pad P and that of the connecting terminal. <P>COPYRIGHT: (C)2003,JPO |
